Dead boards brought back to life — rail tracing, BGA rework, and thermal imaging at the L3 bench.
This is our specialty tier. When a device is 'unfixable' everywhere else, it lands here. We map every power rail under the microscope, find the short or blown component, and resolder at the pad level. Data recovery from dead boards is performed without ever mounting your storage or touching your files — DoD no-snoop throughout.
Rail trace, short isolation, component-level finding
Torn FPC, torn battery, screen flex resolder
PMIC, audio IC, charging IC reball + reflow
Dead-board NAND extraction, no-snoop